Kuo clarifies that the iPhone 15 Pro's thermal issues have no correlation with TSMC's 3nm chip.

Apple recently unveiled the iPhone 15 Pro line of devices, which include important changes including a new titanium frame in place of the stainless steel one, a USB-C connection, and the cutting-edge A17 Pro CPU manufactured using TSMC's cutting-edge 3-nm technology. The iPhone 15 Pro series, meanwhile, is reportedly having serious overheating problems, according to information from several sources.

Initial theories and justifications said that Apple was forced to employ lower-quality CPUs for this year's Pro series due to TSMC's difficulties in producing high yields with their 3nm chips. The heating issues, however, are now said to be unconnected to TSMC's 3nm technology and are instead coming from a separate source, according to renowned industry analyst Ming-Chi Kuo.

According to Kuo, "the primary cause of the heating issue is more likely compromises made in the thermal system design to achieve a lighter weight such as the reduced heat dissipation area and the use of a titanium frame, which negatively impacts thermal efficiency."

To prevent the iPhone 15 Pro models from getting excessively hefty, it appears that Apple may have made compromises in the thermal system design. Apple was successful in reducing the weight of the iPhone 15 Pro model by 19 grams when compared to the previous iPhone 14 Pro model. When paired with the new titanium frame, the adjustments to make the phone lighter may be to blame for the heating problem.

According to Kuo, Apple will probably fix the problem with a software update. The Apple A17 Pro chip's performance could be sacrificed as a result, though, to control temperature. Kuo also warns that the sales of Apple's iPhone 15 Pro series may suffer if the issue isn't resolved by the company properly. What's more important to know is how a problem like this got through the prototype testing stage.