Mediatek's Dimensity 9400 SoC Set to Launch in Q4
The MediaTek Dimensity 9300 chipset boasts a unique configuration, featuring four Cortex-X4 prime CPU cores and four Cortex-A720 performance CPU cores. Forget about those low-power efficiency cores; they're not in the Dimensity 9300's playbook.
Now, brace yourselves for the anticipated Dimensity 9400 SoC, sporting an intriguing setup with one Cortex-X5 Prime CPU core, four Cortex-X4 Prime CPU cores, and four Cortex-A720 performance CPU cores. Once again, no room for efficiency cores in this powerhouse.
Adding to the excitement, the Dimensity 9400 is set to mark a significant milestone as the first in the Dimensity lineup manufactured using TSMC's cutting-edge 3nm process node. Specifically, it will utilize TSMC's second-gen 3nm process node, the N3E, promising potential performance boosts and enhanced energy efficiency. According to MediaTek CEO Rick Tsai, speaking at a recent ceremony, the Dimensity 9400 application processor (AP) is slated for a Q4 release and will feature AI capabilities that can rival other chipsets.
While MediaTek hasn't explicitly named it the Dimensity 9400, Tsai's statements strongly suggest it as the next flagship chip from the fabless chip designer. Like its forerunner, the Dimensity 9400 will support LPDDR5T RAM, a crucial element for on-device AI features. Expect an upgrade over the 33 billion parameter large language model found in the Dimensity 9300, paving the way for an even more robust AI performance.
In the battle of the titans, the Dimensity 9400 faces off against Qualcomm's Snapdragon 8 Gen 4. Qualcomm's contender, introducing its Oryon cores, similarly omits efficiency cores, aligning it with the Dimensity 9400's design. Both chips will roll off TSMC's assembly line using the second-gen 3nm node, promising an intense rivalry in the high-performance chipset arena.
Concerns initially arose about the Dimensity 9300's potential overheating due to the absence of efficiency cores. Last September, rumors circulated, promptly denied by MediaTek. A stress test conducted on the Dimensity 9300 revealed a 46% drop in performance after introducing stress to the AP's cores. Despite these challenges, the Dimensity 9300 powers the Vivo X100 series without major overheating issues, instilling confidence in the upcoming Dimensity 9400 AP.