TSMC and MediaTek Partner to Develop 3nm Chip for Smartphones and Other Devices

Together with TSMC, MediaTek announces the successful tape-out of its first 3nm Dimensity chipset. This chipset was created utilizing the 3nm process. The chip will begin mass manufacturing in 2019 and debut in the second part of 2024.

When compared to its 5nm predecessor, TSMC's 3nm manufacturing technology offers several advantageous features. It gives an 18% speed gain at constant power or a 32% decrease in power consumption with the same performance, and it increases logic density by about 60%. This technique aims to improve performance, power efficiency, and yield for mobile applications and high-performance computer systems.

This chip will be used by MediaTek in a variety of products, including smart cars, tablets, and smartphones. As the industry race to adopt the 3nm technology heats up, this tactical step puts MediaTek at the forefront of chip production.

 Joe Chen, president of MediaTek, praised the partnership with TSMC for its outstanding manufacturing capabilities. He asserted that this relationship will enable MediaTek to show its unique design in flagship chipsets, enabling it to offer high-quality solutions to its global clientele and enhancing the user experience in the flagship market.

According to rumors, Apple might be one of the first companies to use TSMC's 3nm production capability for their forthcoming A17 chip later this year. Contrarily, there is currently little precise information available regarding Qualcomm's 3nm technology. A heated fight between Qualcomm and MediaTek is anticipated to begin when Qualcomm ultimately introduces its 3nm processor.